The US-Singapore Summer Exchange Scholarship Programme is now accepting applications. Over the course of five years, a total of 50 Singapore and 50 US recipients will receive the scholarship, which will provide funding support for recipients to attend a university summer exchange programme in each other’s countries. Each scholarship recipient will receive funding support capped at S$10,000 to cover tuition/programme fees, accommodation, airfare and subsistence allowance.
The scholarship programme is jointly funded by the Government of Singapore and US companies and organisations, namely, Applied Materials, Becton Dickinson, Mastercard and Micron Foundation. Further details can be found on the MFA website.
Applications should be submitted directly to the participating universities as follows:
The scholarship programme, which was announced during Prime Minister Lee Hsien Loong’s Official Visit to the US in August 2016, commemorates the 50th anniversary of diplomatic relations between Singapore and the US. The programme seeks to deepen people-to-people ties and enhance links between Singapore and US universities.
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MINISTRY OF FOREIGN AFFAIRS
15 March 2017